Characterization of post-copper CMP surface with scanning probe microscopy: Part II: Surface potential measurements with scanning Kelvin probe force microscopy

Microelectronic Engineering

Volumn 83, Issue 11-12, 2006, Pages 2355-2358

  Dominget, A ^a   Farkas, J ^a   Szunerits, S ^b  

^a FREESCALE SEMICONDUCTOR INC   (United States)

^b GRENOBLE INSTITUTE OF TECHNOLOGY   (France)

Author keywords

Atomic force microscopy; Chemical mechanical polishing (CMP); Post CMP cleaning

Indexed keywords

ATOMIC FORCE MICROSCOPY; CLEANING; COMPUTER SIMULATION; CONTAMINATION; ELECTROSTATICS; PH EFFECTS;

ELECTROSTATIC SIMULATIONS; KELVIN PROBE FORCE MICROSCOPY (KFM); POST-CMP CLEANING;

CHEMICAL MECHANICAL POLISHING;

EID: 33751314562     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.10.035     Document Type: Article

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