Copper film deposition rates by a hot refractory anode vacuum arc and magnetically filtered vacuum arc

Surface and Coatings Technology

Volumn 201, Issue 7 SPEC. ISS., 2006, Pages 4145-4151

  Shashurin, A ^a   Beilis, I I ^a   Sivan, Y ^a   Goldsmith, S ^a   Boxman, R L ^a  

^a TEL AVIV UNIVERSITY   (Israel)

Author keywords

Cathode utilization rate; Copper film deposition; Deposition rate; Hot refractory anode; Magnetically filtered vacuum arc

Indexed keywords

ANODES; CATHODES; COPPER; PLASMA JETS; VAPOR DEPOSITION;

CATHODE UTILIZATION RATE; COPPER FILM DEPOSITION; HOT REFRACTORY ANODE; MAGNETICALLY FILTERED VACUUM ARC;

VACUUM DEPOSITED COATINGS;

ANODES; CATHODES; COPPER; PLASMA JETS; VACUUM DEPOSITED COATINGS; VAPOR DEPOSITION;

EID: 33751226604     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2006.08.022     Document Type: Article

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