Influence of background gas pressure on copper film deposition and ion current in a hot refractory anode vacuum ARC

Surface and Coatings Technology

Volumn 200, Issue 5-6, 2005, Pages 1395-1400

  Beilis, I I ^a   Shashurin, A ^a   Boxman, R L ^a   Goldsmith, S ^a  

^a TEL AVIV UNIVERSITY   (Israel)

Author keywords

Cathode spots; Coating thickness; Copper film deposition; Deposition in background gas; Hot refractory anode; Plasma plume; Vacuum arc

Indexed keywords

COPPER; MOLECULAR WEIGHT; MOLYBDENUM; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PRESSURE EFFECTS; PROFILOMETRY; THICKNESS MEASUREMENT; VACUUM DEPOSITED COATINGS;

CATHODE SPOTS; COATING THICKNESS; COPPER FILM DEPOSITION; GAS PRESSURE; GLASS MICROSCOPE SLIDE SUBSTRATES; HOT REFRACTORY ANODE VACUUM ARC (HRAVA); PLASMA PLUME;

METALLIC FILMS;

COATING;

EID: 28844454273     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2005.08.040     Document Type: Article

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