Copper film deposition by a hot refractory anode vacuum arc

Surface and Coatings Technology

Volumn 177-178, Issue , 2004, Pages 233-237

  Beilis, I I ^a   Shashurin, A ^a   Arbilly, D ^a   Goldsmith, S ^a   Boxman, R L ^a  

^a TEL AVIV UNIVERSITY   (Israel)

Author keywords

Cathode spots; Coating thickness; Copper film deposition; Hot refractory anode; Plasma plume; Radial plasma expansion; Substrate; Vacuum arc

Indexed keywords

COATINGS; COPPER; DEPOSITION; OPTICAL MICROSCOPY; PARTICLE SIZE ANALYSIS;

MACROPARTICLES (MP); PLASMA PLUMES;

METALLIC FILMS;

COATING;

EID: 1342268156     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2003.09.038     Document Type: Article

References (8)

1. Boxman R.L. Martin P. Sanders D. Handbook of Vacuum Arc Science and Technology 1995 Noyes Publishing Ridge Park, NJ
2. Miller H.C. Boxman R.L. Martin P. Sanders D. Handbook of Vacuum Arc Science and Technology 1995 Noyes Publishing Ridge Park, NJ
3. Ehrich H. Hasse B Mausbach M. Muller M. J. Vac. Sci. Technol. A 8 3 1990 2164
4. Beilis I.I. Keidar M. Boxman R.L. Goldsmith S. Phys. Plasmas 7 N7 2000 3068
5. Beilis I.I. Boxman R.L. Goldsmith S. Phys. Plasmas 9 N7 2002 3159
6. Beilis I.I. Boxman R.L. Goldsmith S. Paperny V.L. J. Appl. Phys. 88 N11 2000 6224
7. Beilis I.I. Boxman R.L. Goldsmith S. Surf. Coat. Technol. 133-134 1-3 2000 91
8. Daalder J. J. Phys. D: Appl. Phys. 9 1976 2379