Magnetron target designs to improve wafer edge trench filling in ionized metal physical vapor deposition

Thin Solid Films

Volumn 515, Issue 4, 2006, Pages 2452-2457

  Lu, Junqing ^a   Yoon, Jae Hong ^b   Shin, Keesam ^b   Park, Bong Gyu ^b   Yang, Lin ^a  

^a ANHUI UNIVERSITY OF TECHNOLOGY   (China)

^b Changwon National University   (South Korea)

Author keywords

Across wafer uniformity; Ionized PVD; Sputtering; View factor

Indexed keywords

ANGLE MEASUREMENT; HEAT RADIATION; IONIZATION; MAGNETRON SPUTTERING; METALS; PHYSICAL VAPOR DEPOSITION; THICKNESS MEASUREMENT;

ACROSS-WAFER UNIFORMITY; ANGULAR DISTRIBUTIONS; TRENCH SIDEWALLS; VIEW FACTORS;

MAGNETRONS;

EID: 33751204463     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2006.06.031     Document Type: Article

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