Thin, high atomic weight refractory film deposition for diffusion barrier, adhesion layer, and seed layer applications

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 14, Issue 3, 1996, Pages 1819-1827

  Rossnagel, S M ^a   Nichols, C ^a,b   Hamaguchi, S ^a   Ruzic, D ^a,c   Turkot, R ^a,c  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b Asian and Middle Eastern Studies Program   (United States)

^c University of Illinois at Urbana Champaign   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0242366928     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.588562     Document Type: Article

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