Effect of overburden thickness on the copper microstructure of dual-inlaid interconnect structures

AIP Conference Proceedings

Volumn 817, Issue , 2006, Pages 211-216

  Yan, M Y ^a,b   Tu, K N ^b   Vairagar, A V ^a   Meyer, M A ^a   Geisler, H ^a   Preusse, A ^a   Zschech, E ^a  

^a IBM MICROELECTRONICS   (United States)

^b University of California   (United States)

Author keywords

Cu dual inlaid interconnects; EBSD; Microstructure; Texture

Indexed keywords

EID: 33751200955     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.2173552     Document Type: Conference Paper

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