A thermal convective accelerometer system based on a silicon sensor-Study and packaging

Sensors and Actuators, A: Physical

Volumn 132, Issue 1 SPEC. ISS., 2006, Pages 147-153

  Kaltsas, G ^a,b   Goustouridis, D ^b   Nassiopoulou, A G ^b  

^a UNIVERSITY OF WEST ATTICA   (Greece)

^b INSTITUTE OF NANOSCIENCE AND NANOTECHNOLOGY   (Greece)

Author keywords

Accelerometer; Interface circuit; Packaging; Thermal sensor

Indexed keywords

ELECTRONICS PACKAGING; HEAT CONVECTION; NATURAL FREQUENCIES; PRODUCT DESIGN; SILICON SENSORS; VISCOSITY; WAVEFORM ANALYSIS;

ELECTRONIC INTERFACE; INTERFACE CIRCUITS; PACKAGING PARAMETERS; THERMAL SENSORS;

ACCELEROMETERS;

EID: 33751082716     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2006.04.026     Document Type: Article

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