Effect of deposition process parameters on resistivity of metal and alloy films deposited using anodic vacuum arc technique

Thin Solid Films

Volumn 515, Issue 4, 2006, Pages 1753-1757

  Sinha, M K ^a   Mukherjee, S K ^a   Pathak, B ^a   Paul, R K ^a   Barhai, P K ^a  

^a BIRLA INSTITUTE OF TECHNOLOGY   (India)

Author keywords

Aluminum; Anodic vacuum arc; Copper; Grain size; Nichrome; Plasma processing and deposition; Resistivity; Thin films

Indexed keywords

ALUMINUM; COPPER; DEPOSITION; ELECTRIC CONDUCTIVITY; GRAIN SIZE AND SHAPE; PLASMA APPLICATIONS;

ANODIC VACUUM ARCS; NICHROMES; PLASMA DEPOSITION; PLASMA PROCESSING;

THIN FILMS;

EID: 33750832341     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2006.06.028     Document Type: Article

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