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Volumn 20, Issue 12, 2006, Pages 1295-1320

Thermal residual stresses in an adhesively-bonded functionally graded single-lap joint

Author keywords

Adhesive; Functionally graded material; Single lap joint; Thermal residual stress

Indexed keywords

ADHESIVE JOINTS; ADHESIVES; CERAMIC MATERIALS; COOLING; ELASTIC MODULI; FINITE ELEMENT METHOD; THERMAL STRESS; FUNCTIONALLY GRADED MATERIALS; MECHANICAL PROPERTIES; RESIDUAL STRESSES; SHEAR STRESS; THREE DIMENSIONAL;

EID: 33750552971     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856106778456591     Document Type: Article
Times cited : (19)

References (34)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.