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Volumn 20, Issue 12, 2006, Pages 1295-1320
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Thermal residual stresses in an adhesively-bonded functionally graded single-lap joint
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Author keywords
Adhesive; Functionally graded material; Single lap joint; Thermal residual stress
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Indexed keywords
ADHESIVE JOINTS;
ADHESIVES;
CERAMIC MATERIALS;
COOLING;
ELASTIC MODULI;
FINITE ELEMENT METHOD;
THERMAL STRESS;
FUNCTIONALLY GRADED MATERIALS;
MECHANICAL PROPERTIES;
RESIDUAL STRESSES;
SHEAR STRESS;
THREE DIMENSIONAL;
JOINT FAILURE;
METAL PHASES;
SINGLE-LAP JOINTS;
THERMAL RESIDUAL STRESSES;
FUNCTIONALLY GRADED MATERIALS;
CERAMIC MATERIALS;
ADHERENDS;
ADHESIVE LAYERS;
ADHESIVE STRESS;
ADHESIVE-ADHEREND INTERFACE;
CERAMIC LAYER;
COMPOSITIONAL GRADIENTS;
CRITICAL REGION;
EDGE CONDITIONS;
FREE EDGE;
FUNCTIONALLY GRADED;
JOINT FAILURE;
LAYER NUMBER;
LAYERED FINITE ELEMENTS;
METAL PHASE;
NI METAL;
NORMAL STRESS;
OVERLAP REGION;
PEAK STRESS;
PEEL STRESS;
POWER LAW;
SINGLE LAP JOINTS;
STRESS PROFILE;
THERMAL RESIDUAL STRESS;
TRANSVERSE SHEAR STRESS;
VON MISES STRESS;
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EID: 33750552971
PISSN: 01694243
EISSN: None
Source Type: Journal
DOI: 10.1163/156856106778456591 Document Type: Article |
Times cited : (19)
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References (34)
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