New approach in depositing thick, layered cubic boron nitride coatings by oxygen addition-structural and compositional analysis

Thin Solid Films

Volumn 515, Issue 3, 2006, Pages 1058-1062

  Lattemann, M ^a,b   Ulrich, S ^b   Ye, J ^b  

^a LINKÖPING UNIVERSITY   (Sweden)

^b KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

Adhesion; Cubic boron nitride; EELS; HRTEM; Stress reduction

Indexed keywords

ADHESION; COMPOSITION; COMPRESSIVE STRESS; DEPOSITION; ELECTRON ENERGY LOSS SPECTROSCOPY; FOURIER TRANSFORM INFRARED SPECTROSCOPY; INDUSTRIAL APPLICATIONS; NUCLEATION; SCANNING ELECTRON MICROSCOPY;

ANALYTICAL SCANNING TRANSMISSION ELECTRON MICROSCOPY (ASTEM); HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY (HRTEM); STRESS REDUCTION;

BORIDE COATINGS;

EID: 33750463752     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2006.07.069     Document Type: Article

References (28)

1. Inagawa K., Watanabe K., Ohsone H., Saitoh K., and Itoh A. J. Vac. Sci. Technol., A, Vac. Surf. Films 5 (1987) 2696
2. Chayahara A., Yakoyama H., Imura T., and Osaka Y. Appl. Surf. Sci. 33-34 (1988) 561
3. Mineta S., Kohata M., Yasunaga N., and Kikuta Y. Thin Solid Films 189 (1990) 125
4. Friedmann T., Mirkarimi P., D.M., et al. J. Appl. Phys. 76 (1994) 3088
5. Kidner S., Taylor II C., and Clarke R. Appl. Phys. Lett. 64 (1994) 1859
6. Hofsäss H., Feldermann H., Sebastian M., and Ronning C. Phys. Rev., B 55 (1997) 13230
7. Vel L., Demazeau G., and Etourneau J. Mater. Sci. Eng., B, Solid-State Mater. Adv. Technol. B 10 (1991) 149
8. Holleck H. J. Vac. Sci. Technol., A, Vac. Surf. Films 4 (1986) 2661
9. Mirkarimi P., McCarty K., and Medlin D. Mater. Sci. Eng., R Rep. 21 (1997) 47
10. Wentorf R. J. Chem. Phys. 36 (1962) 1990
11. Zhao X.-A., Ong C., K.C., et al. J. Vac. Sci. Technol., A, Vac. Surf. Films 15 (1997) 2297
12. Litvinov D., Taylor II C., and Clarke R. Diamond Relat. Mater. 7 (1998) 360
13. Yoshida T. Diamond Relat. Mater. 5 (1996) 501
14. Yamamoto K., Keunecke M., and Bewilogua K. Thin Solid Films 377/378 (2000) 331
15. Zhang W., and Matsumoto S. Appl. Phys., A 71 (2000) 469
16. Boyen H.-G., Widmayer P., Schwertberger D., Deyneka N., and Ziemann P. Appl. Phys. Lett. 76 (2000) 709
17. Barth K.-L., Lunk A., and Ulmer J. Surf. Coat. Technol. 92 (1997) 96
18. Klett A., Freudenstein R., and Kulisch W. Thin Solid Films 398-399 (2001) 130
19. Ulrich S., Nold E., Sell K., Stüber M., Ye J., and Ziebert C. Surf. Coat. Technol. 200 (2006) 6465
20. Ziebert C., Ye J., Sell K., and Ulrich S. Surf. Coat. Technol. 200 (2006) 6454
21. Bundy F., and Wentorf R. J. Chem. Phys. 38 (1963) 1144
22. Widmayer P., Ziemann P., Ulrich S., and Ehrhardt H. Diamond Relat. Mater. 6 (1997) 621
23. Gielisse P., Mitra S., J.P., et al. Phys. Rev. 155 (1967) 1039
24. Geick R., Perry C., and Rupprecht G. Phys. Rev. 146 (1966) 543
25. McKenzie D., McFall W., Sainty W., Davis C., and Collins R. Thin Solid Films 193 (1990) 418
26. McKenzie D., Green D., Swift P., Cockayne D., Martin P., Netterfield R., and Sainty W. Diamond Relat. Mater. 2 (1993) 970
27. Schmid H. Microsc. Microanal. Microstruct. 6 (1995) 99
28. Hubert H., Gravie L., Buseck P., Petuskey W., and McMillan P. Abstr. 12th Int. Symp. on Boron, Borides, and Related Compounds (1996) 56