The effects of multiple zincation process on aluminum bond pad surface for electroless nickel immersion gold deposition

Journal of Electronic Packaging

Volumn 128, Issue 3, 2006, Pages 246-250

  Md Arshad, M K ^a   Ahmad, I ^b   Jalar, A ^b   Omar, G ^c   Hashim, U ^a  

^a UNIVERSITY MALAYSIA PERLIS   (Malaysia)

^b UNIVERSITI KEBANGSAAN MALAYSIA   (Malaysia)

^c ON Semiconductor SCG Industries M Sdn Bhd Malaysia   (Malaysia)

Author keywords

Electroless nickel immersion gold (ENIG); Under bump metallurgy (UBM); Zincation

Indexed keywords

ALUMINUM; GOLD; MORPHOLOGY; SOLDERING; SURFACE TOPOGRAPHY; THIN FILMS;

ELECTROLESS NICKEL IMMERSION GOLD (ENIG); UNDER BUMP METALLURGY (UBM); ZINCATION;

ELECTROLESS PLATING;

EID: 33750322489     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2229223     Document Type: Article

References (10)

1. Qi, G., Fokkink Lambertus, G. J., and Chew, K.-H., 2002, "Zincating Morphology of Aluminum Bond Pad: Its Influence on Quality of Electroless Nickel Bumping," Thin Solid Films, 406(1-2), pp. 219-223.
2. Qi, G., Chen, X., and Shao, Z., 2002, "Influence of Bath Chemistry on Zincate Morphology on Aluminum Bond Pad," Thin Solid Films, 406(1-2), pp. 204-214.
3. Simon, J., Zakel, E., and Reichl, H., 1990, "Electroless Deposition of Bumps for TAB Technology," Proceedings of 40th Electronic Components and Technology Conference, pp. 412-417.
4. Lin, K.-L., and Chang, S.-Y., 1996, "The Morphologies and the Chemical States of the Multiple Zincating Deposits on the Al Pads of Si Chips," Thin Solid Films, 288(1-2), pp. 36-40.
5. Yau, E.-W.-C., Gong, J.-F., and Chan, P., 2003, "Al Surface Morphology Effect on Flip-Chip Solder Bump Shear Strength," Microelectron. Reliab., 44(2), pp. 323-331.
6. Lee, S.-K., Jin, J.-G., Kim, Y.-H., and Lee, J.-H., 2001, "A Study on the Nucleation Behavior of Zinc Particles on Aluminum Substrate," International Symposium on Electronics Material and Packaging, EMAP 2001, pp. 73-78.
7. Ng, W.-C., Ko, T.-M., William, C., and Qi, G.-J., 1998, "The Effect of Immersion Zincation to the Electroless Nickel Under-Bump Materials in Microelectronics Packaging," Proceedings of the 2nd Electronics Packaging Technology Conference, pp. 89-94.
8. Hutt, D. A., Liu, C., Conway, P. P., Whalley, D. C., and Mannan Samjid, H., 2002, "Electroless Nickel Bumping of Aluminum Bond Pads. Part I: Surface Pretreatment and Activation," IEEE Trans. Compon. Packag. Technol., 25(1), pp. 87-97.
9. Strandford, A. J. G., Popelar, S., and Jauerning, C., 2002, "Interconnecting to Aluminum- and Copper-based Semiconductor (Electroless-Nickel/Gold for Solder Bumping and Wire Bonding)," Microelectron. Reliab., 42(2), pp. 265-283.
10. Ostman, A., Simon, J., and Reichl, H., 1993, "The Pretreatment of Aluminum Bond Pads for Electroless Nickel Bumping," Proceedings IEEE, Multichip Module Conference, pp. 74-78.