Al surface morphology effect on flip-chip solder bump shear strength

Microelectronics Reliability

Volumn 44, Issue 2, 2004, Pages 323-331

  Yau, Esther Wai Ching ^a   Gong, Jing Feng ^a   Chan, Philip ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BALL SHEAR TEST; SOLDER BUMPS;

ALUMINUM; GOLD PLATING; NITRIC ACID; SHEAR STRENGTH; SOLDERING ALLOYS; SPUTTERING; SURFACES; THERMAL EFFECTS; WETTING;

FLIP CHIP DEVICES;

EID: 0742304129     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00159-8     Document Type: Article

References (7)

1. Strandjord JG, Popelar F, Erickson A. Low cost wafer bumping processes for flip chip applications (electroless nickel-gold/stencil printing). Proceedings of IMAPS, Chicago, USA, 1999.
2. Cai J, Teng A, Chan CH, Law PC, Xiao GW. A study on microstructure and reliability tests of low cost flip chip. Proceedings of International Symposium on Electronic Materials and Packaging, Hong Kong, China, 2000. p. 91-8.
3. Simon J, Aakel E, Reichl H. Electroless deposition of bumps for TAB technology. Proceeding of 40th Electronic Components and Technology Conference, Las Vegas, NV, USA, vol. 1, 1990. p. 412-7.
4. Ostmann A, Simon J, Reichl H. The pretreatment of Al bond pads for electroless nickel bumping. Proceeding of IEEE MCM Conference, Santa Cruz, CA, 1993. p. 748-51.
5. Ng WC, Ko TM, Chen W, O GJ. The effects of immersion zincation to the electroless nickel under bump materials in microelectronics packaging, Proceeding of Second Electronics Packaging Technology Conference, Singapore, 1998. p. 89-94.
6. Liu C., Hutt A., Whalley D.C., Conway P.P. Under bump metallisation of fine pitch flip-chip using electroless nickel deposition. J Electron Manufact. 10(3):2000;161-170.
7. Cai J, Law PC, Teng A, Chan CH. Influences of pad shape and solder microstructure on shear force of low cost flip chip bumps. Proceeding of International Symposium on Electronic Materials and Packaging, 2000.