Investigation of energy loss mechanisms in micromechanical resonators

TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers

Volumn 1, Issue , 2003, Pages 332-335

  Candler, R N ^a   Li, H ^a   Lutz, M ^b   Park, W T ^a   Partridge, A ^b   Yama, G ^b   Kenny, T W ^a  

^a STANFORD UNIVERSITY   (United States)

^b BOSCH RESEARCH AND TECHNOLOGY CENTER   (United States)

Author keywords

Clamps; Damping; Encapsulation; Energy loss; Micromechanical devices; Resonant frequency; Seals; Temperature; Thermal resistance; Thermoelasticity

Indexed keywords

ACTUATORS; CLAMPING DEVICES; DAMPING; ENCAPSULATION; ENERGY DISSIPATION; HEAT RESISTANCE; MICROSYSTEMS; NATURAL FREQUENCIES; RESONATORS; SEALS; SOLID-STATE SENSORS; TEMPERATURE; THERMOELASTICITY; TRANSDUCERS;

ENCAPSULATION PROCESS; ENERGY LOSS MECHANISMS; EXPERIMENTAL VERIFICATION; MICROMECHANICAL DEVICE; RATIO OF LENGTH TO WIDTHS; SCALING THEORIES; THERMOELASTIC DAMPING; THERMOELASTIC DISSIPATION;

MICROMECHANICAL RESONATORS;

EID: 84944747328     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2003.1215320     Document Type: Conference Paper

References (5)

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4. W. E. Newell, "Miniaturization of Tuning Forks," Science, pp. 1320-1326, 1968.
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