Evaporator/boiler design for thermosyphons utilizing segregated hydrofluoroether working fluids

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn 2006, Issue , 2006, Pages 69-77

  Tuma, Phillip E ^a  

^a 3M COMPANY   (United States)

Author keywords

Boiling Enhancement; Hydrofluoroether; Thermosyphon

Indexed keywords

BOILING ENHANCEMENT; MICRO POROUS METALLIC COATING; SEGREGATED HYDROFLUOROETHER WORKING FLUIDS; THERMOSYPHONS;

COATINGS; ELECTRONICS ENGINEERING; EVAPORATORS; FLUID DYNAMICS; MICROPOROUS MATERIALS; PRODUCT DESIGN;

BOILERS;

EID: 33750114109     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (23)

1. C. Lasance and R. Simons, "Advances in High Performance Cooling," Electronics Cooling, Vol. 11(4), pp. 22-38, November 2005.
2. Palm, B. and Khodabandeh, R., "Choosing Working Fluid for Two-Phase Thermosyphon Systems for Cooling of Electronics," Trans. ASME, Vol 125, pp. 276-281, June 2003.
3. Tuma, P.E., "Segregated Hydrofluoroethers: Long Term Alternative Heat Transfer Liquids," Proceedings of the 2000 Earth Technologies Forum, pp. 266-275, Oct.30-Nov.1, Washington D.C.
4. El-Genk, M.S. and Bostanci, H., "Saturation Boiling of HFE-7100 from a Copper Surface, Simulating a Microelectronic Chip," IJHMT, Vol. 46, pp. 1841-1854, 2003.
5. Nakayama, W., et al, "Heat Sink Studs Having Enhanced Boiling Surfaces for Cooling Microelectronic Components," ASME Paper No. 84-WA/HT-89, 1984.
6. Pal, A., et al, "Design and Performace Evaluation of a Compact Thermosyphon," IEEE Transactions on Components and Packaging Technologies, Vol. 25(4), pp. 601-607, December 2002.
7. Mukherjee, S. and Mudawar, I., "Smart Pumpless Loop for Micro-Channel Electronic Cooling Using Flat and Enhanced Surfaces," IEEE Trans. of Components and Packaging Technologies, Vol. 26(1), March 2003.
8. Chien, L.H, and Chen, C.W., "Boiling of Enhanced Surfaces at High Heat fluxes in a Small Boiler," Proc. of IPACK2005, ASME InterPACK'05, July 17-22, San Fancisco, California.
9. McGillis, W.R., et al, "Pool Boiling Enhancement Techniques for Water at Low Pressure," WRL Research Report 90/9, Western Digital, December 1990.
10. R. Chu, R. Simons and G. Chrysler, "Experimental Investigation of an Enhanced Thermosyphon Heat Loop for Cooling of a High Performance Electronics Module," 15th IEEE SEMI-THERM Symposium, March 9-11, San Diego, California, 1999.
11. Klett, J.W., Trammell, M. and Boudreaux, P., "Parametric Investigation of a Graphite Foam Evaporator in a Thermosyphon with Fluorinert™ and a Silicon CMOS Chip," IEEE Transactions on Device and Materials Reliability Vol. 4(3), p. 626, September 2004.
12. Parker, J.L. and El-Genk, M.S., "Effect of Inclination on Pool Boiling of FC-72 Dielectric Liquid on Porous Graphite," Proc. 2005 ASME Summer Heat Transfer Conference, July 17-22, San Francisco, California.
13. Moghaddam, S., et al, "Pool Boiling of Water and FC-72 on Copper and Graphite Foams," Proc. of ASME InterPACK'3, I. Electronic Packaging Technical Conf. and Exhibition, July 6-11, Maui, Hawaii, 2003.
14. Chang, J.Y. and You, S.M., "Boiling Heat Transfer Phenomena from Microporous and Porous Surfaces in Saturated FC-72," IJHMT, Vol. 40(18), pp.4437-4447, 1997.
15. Chang, J.Y. and You, S.M., "Enhanced Boiling Heat Transfer from Micro-Porous Surfaces: A Coating Composition and Method," IJHMT, Vol. 40(18), pp.4449-4460, 1997.
16. K.N. Rainey, S.M. You and S. Lee, "Effect of Pressure, Subcooling, and Dissolved Gas on Pool Boiling Heat Transfer from Microporous, Square Pin-finned Surfaces in FC-72," IJHMT, Vol. 46, pp. 23-35, 2003.
17. Honda, H., Takamatsu, H., and Wei, J.J., "Enhanced Boiling of FC-72 on Silicon Chips with Micro-Pin-Fins and Submicron-Scale Roughness," J. Heat Transfer, Vol. 124, pp.383-390, 2002.
18. Liter, S.G. and Kaviany, M., "Pool-boiling CHF Enhancement by Modulated Porous-Layer Coating: Theory and Experiment," IJHMT, Vol. 44, pp. 4287-4311, 2001
19. Colgan, E.G., et al, "A Practical Implementation of Silicon Microchannel Coolers for High Power Chips," 21st IEEE SEMI-THERM Symposium, San Francisco, California, March 2005.
20. Ellsworth, M.J. and Simons, R.E., "High Powered Chip Cooling," Electronics Cooling, Vol. 11(3), pp. 14-22, August 2005
21. A good reference source for these technologies is: Mudawar, I., "Assessment of High-Heat-Flux Thermal Management Schemes," IEEE Transactions of Components and Packaging Technologies," Vol. 24(2), pp.122-141, 2001.Another is...
22. Webb. R.L. "Principles of Enhanced Heat Transfer," John Wiley and Sons (New York, 1994).
23. Tehver, J., et al, "Heat Transfer and Hysteresis Phenomena in Boiling on Porous Plasma-Sprayed Surface," Experimental Thermal and Fluid Science, Vol. 5, pp. 714-727, 1992.