Choosing working fluid for two-phase thermosyphon systems for cooling of electronics

Journal of Electronic Packaging

Volumn 125, Issue 2 SPEC., 2003, Pages 276-281

  Palm, Björn ^a   Khodabandeh, Rahmatollah ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

BOILING LIQUIDS; COMPUTER SIMULATION; COOLING; ELECTRONIC EQUIPMENT; FLUIDS; HEAT LOSSES; HEAT RESISTANCE; HEAT TRANSFER; HEAT TRANSFER COEFFICIENTS; PRESSURE DROP;

ELECTRONIC COMPONENTS; HIGH PRESSURE FLUIDS; THERMOSYPHON SYSTEMS;

HEAT PIPES;

EID: 0141606844     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1571570     Document Type: Article

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