Pool boiling of water and FC-72 on copper and graphite foams

Advances in Electronic Packaging

Volumn 2, Issue , 2003, Pages 675-680

  Moghaddam, Saeed ^a   Ohadi, Michael ^b   Qi, Jianwei ^b  

^a Adv Thermal/Environmental Concepts   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOILING LIQUIDS; BUBBLES (IN FLUIDS); COOLING; COPPER; ELECTRONIC EQUIPMENT; ENERGY MANAGEMENT; FOAMS; GRAPHITE; HEAT FLUX; HEAT TRANSFER COEFFICIENTS; MATHEMATICAL MODELS; MECHANICAL PERMEABILITY; MICROSTRUCTURE; NUCLEATION; POROSITY; THERMAL CONDUCTIVITY; ELECTRONICS PACKAGING; LAKES;

ELECTRONIC COOLING; FOAM STRUCTURE; THERMAL EFFICIENCY; COPPER FOAM; GRAPHITE FOAM; HIGH FLUX; MESOPHASES; PLAIN SURFACES; POOL BOILING; POOL BOILING HEAT TRANSFER;

HEAT TRANSFER; COPPER;

EID: 1242264337     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35316     Document Type: Conference Paper

References (14)

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