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1
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33749653978
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H. Struyf, D. Hendrickx, J. Van Olmen, F. Iacopi, O. Richard, Y. Travaly, M. Van Hove, W. Boullart, S. Vanhaelemeersch, IITC proc., 2005
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(2005)
IITC Proc.
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Struyf, H.1
Hendrickx, D.2
Van Olmen, J.3
Iacopi, F.4
Richard, O.5
Travaly, Y.6
Van Hove, M.7
Boullart, W.8
Vanhaelemeersch, S.9
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2
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1842425374
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F. Iacopi, K. Maex, M. Stucchi, O. Richard, Electrochemical and Solid State Letters, 7 (4), G79-G82, 2004
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(2004)
Electrochemical and Solid State Letters
, vol.7
, Issue.4
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Iacopi, F.1
Maex, K.2
Stucchi, M.3
Richard, O.4
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3
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33749675162
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to be submitted
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Y. Travaly, M. Bamal, L. Carbonel, V. Sutcliffe, F. Iacopi, M. Stucchi, M. Van Hove, K. Maex, IEEE Trans. on electron devices, to be submitted
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IEEE Trans. on Electron Devices
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Travaly, Y.1
Bamal, M.2
Carbonel, L.3
Sutcliffe, V.4
Iacopi, F.5
Stucchi, M.6
Van Hove, M.7
Maex, K.8
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4
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4944219693
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W. Zhang, S.H. Brongersma, T. Clarysse, V. Terzieva, E. Rosseel, W. Vandervorst, K. Maex, J. Vac. Sci. Technol. B 22 (4), p. 1830 2004
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(2004)
J. Vac. Sci. Technol. B
, vol.22
, Issue.4
, pp. 1830
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Zhang, W.1
Brongersma, S.H.2
Clarysse, T.3
Terzieva, V.4
Rosseel, E.5
Vandervorst, W.6
Maex, K.7
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5
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4544282492
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W. Zhang, S.H. Brongersma, O. Richard, B. Brijs, R. Palmans, L. Froyen, K. Maex, Microelectronic engineering,76, p. 146 2004
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(2004)
Microelectronic Engineering
, vol.76
, pp. 146
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Zhang, W.1
Brongersma, S.H.2
Richard, O.3
Brijs, B.4
Palmans, R.5
Froyen, L.6
Maex, K.7
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6
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33749667876
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W. Steinhögl, G. Schindler, G. Steinlesberger, M. Traving, M. Engelhardt, J. Appl. Phys. 97, 2005
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(2005)
J. Appl. Phys.
, vol.97
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Steinhögl, W.1
Schindler, G.2
Steinlesberger, G.3
Traving, M.4
Engelhardt, M.5
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7
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33749650484
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Y. Travaly, N. Kemeling, M. Maenhoudt, S. Peeters, et al. Proc. AMC, p. 7132003
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(2003)
Proc. AMC
, pp. 713
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Travaly, Y.1
Kemeling, N.2
Maenhoudt, M.3
Peeters, S.4
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8
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0036539099
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P. Kapur, J. McVittie, K. C. Saraswat, IEEE Trans. on electron devices, Vo. 49, No. 4, p. 590, 2002
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(2002)
IEEE Trans. on Electron Devices
, vol.49
, Issue.4
, pp. 590
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Kapur, P.1
McVittie, J.2
Saraswat, K.C.3
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9
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0034187895
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M.R.Baklanov, K.P.Mogilnikov, V.G.Polovinkin, F.N.Dultsev. J.Vac.Sci.Technol. B18, 1385 (2000)
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(2000)
J.Vac.Sci.Technol
, vol.B18
, pp. 1385
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Baklanov, M.R.1
Mogilnikov, K.P.2
Polovinkin, V.G.3
Dultsev, F.N.4
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10
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0033693135
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J.A.Rogers,A.Maznev, M.J.Banet, K.A.Nelson, Annu.Rev.Mater.Sci30,pp.17- 157,2000
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(2000)
Annu.Rev.Mater.Sci
, vol.30
, pp. 17-157
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Rogers, J.A.1
Maznev, A.2
Banet, M.J.3
Nelson, K.A.4
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12
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33749682015
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S.Diego, Ca., USA
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T.Abell, F.Iacopi, G.Prokopowicz, B.Sun, A.Mazurenko, Y.Travaly, M.Baklanov, C.Sullivan, S.Brongersma, H-C.Liou, J.Tower, M.Gostein, M.Gallagher, J.Calvert, M.Moinpour, K.Maex, Advanced Metallization Conference 2004, S.Diego, Ca., USA.
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Advanced Metallization Conference 2004
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Abell, T.1
Iacopi, F.2
Prokopowicz, G.3
Sun, B.4
Mazurenko, A.5
Travaly, Y.6
Baklanov, M.7
Sullivan, C.8
Brongersma, S.9
Liou, H.-C.10
Tower, J.11
Gostein, M.12
Gallagher, M.13
Calvert, J.14
Moinpour, M.15
Maex, K.16
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13
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33749668938
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to be presented at the June 6-8, S.Francisco, USA
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F.Iacopi, S.Brongersma, A.Mazurenko, H.Struyf, G.Mannaert, Y.Travaly, A.Maznev, T.J.Abell, J.Tower, K.Maex, to be presented at the International Interconnect Technology Conference, June 6-8, 2005 S.Francisco, USA.
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(2005)
International Interconnect Technology Conference
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Iacopi, F.1
Brongersma, S.2
Mazurenko, A.3
Struyf, H.4
Mannaert, G.5
Travaly, Y.6
Maznev, A.7
Abell, T.J.8
Tower, J.9
Maex, K.10
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14
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33749674809
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symp.R (Fundamentals of Nanoindentation and Nanotribology)
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F.Iacopi, M.Laknin, D.Vanhaeren, and S.H.Brongersma, Mat.Res.Symp.Proc. Vol.841, symp.R (Fundamentals of Nanoindentation and Nanotribology), 2004
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(2004)
Mat.Res.Symp.Proc.
, vol.841
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Iacopi, F.1
Laknin, M.2
Vanhaeren, D.3
Brongersma, S.H.4
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15
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33749669540
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Creep behaviour of low-k polymer films: Importance of the matrix material and effect of porosity
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submitted to feb.
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F.Iacopi, S.H.Brongersma, A.Mulloy, J.M.J.den Toonder, "Creep behaviour of low-k polymer films: importance of the matrix material and effect of porosity", submitted to Applied Physics Letters, feb.2005.
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(2005)
Applied Physics Letters
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Iacopi, F.1
Brongersma, S.H.2
Mulloy, A.3
Den Toonder, J.M.J.4
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17
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33749665730
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to be presented at the S.Francisco, April
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F.Iacopi, C.Waldfried, T.Abell, E.P.Guyer, B.Eyckens, Y.Travaly, T.Sajavaara, D.M.Gage, G.Beyer, I.Berry, R.H.Dauskardt and K.Maex, to be presented at the MRS Spring meeting, symp B (Materials, technology and reliability of advanced interconnects), S.Francisco, April 2005.
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(2005)
MRS Spring Meeting, Symp B (Materials, Technology and Reliability of Advanced Interconnects)
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Iacopi, F.1
Waldfried, C.2
Abell, T.3
Guyer, E.P.4
Eyckens, B.5
Travaly, Y.6
Sajavaara, T.7
Gage, D.M.8
Beyer, G.9
Berry, I.10
Dauskardt, R.H.11
Maex, K.12
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18
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33749684048
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J.M.Sanchez, S.El-Mansy, B.Sun, T.Scherban, N.Fang, D.Pantuso, W.Ford, M.R.Elizalde, J.M.Martinez-Esnaola, A.Martin-Meizoso, J.Gil-Sevillano, M.Fuentes and J.Maiz.
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J.M.Sanchez, S.El-Mansy, B.Sun, T.Scherban, N.Fang, D.Pantuso, W.Ford, M.R.Elizalde, J.M.Martinez-Esnaola, A.Martin-Meizoso, J.Gil-Sevillano, M.Fuentes and J.Maiz.
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19
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12844271093
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S.H.Brongersma, D.Degryse, J.Souiller, B.Vandevelde, K.Maex, Mat.Res.Soc.Symp. Proc. Vol.812,F5.5.1 (2004).
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(2004)
Mat.Res.Soc.Symp. Proc.
, vol.812
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Brongersma, S.H.1
Degryse, D.2
Souiller, J.3
Vandevelde, B.4
Maex, K.5
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20
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33749651623
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in press
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Y Travaly, J. Schuhmacher, A. M. Hoyas, T. Abell, V. Sutcliffe, M. Van Hove, K. Maex, Journal of Applied Physics 97 (6) 2005, in press.
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(2005)
Journal of Applied Physics
, vol.97
, Issue.6
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Travaly, Y.1
Schuhmacher, J.2
Hoyas, A.M.3
Abell, T.4
Sutcliffe, V.5
Van Hove, M.6
Maex, K.7
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21
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33749685486
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G. Mannaert, M. R. Baklanov, Q. T. Le, Y. Travaly, W. Boullart, and S.Vanhaelemeersch, Journal of Vacuum Science and Technology B, 2005
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(2005)
Journal of Vacuum Science and Technology B
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Mannaert, G.1
Baklanov, M.R.2
Le, Q.T.3
Travaly, Y.4
Boullart, W.5
Vanhaelemeersch, S.6
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