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Volumn 788, Issue , 2005, Pages 475-481

Aggressive scaling of Cu/low k: Impact on metrology

Author keywords

Cu; Interface characterization; Lowk; Scaling

Indexed keywords


EID: 33749661211     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.2063005     Document Type: Conference Paper
Times cited : (1)

References (23)
  • 15
    • 33749669540 scopus 로고    scopus 로고
    • Creep behaviour of low-k polymer films: Importance of the matrix material and effect of porosity
    • submitted to feb.
    • F.Iacopi, S.H.Brongersma, A.Mulloy, J.M.J.den Toonder, "Creep behaviour of low-k polymer films: importance of the matrix material and effect of porosity", submitted to Applied Physics Letters, feb.2005.
    • (2005) Applied Physics Letters
    • Iacopi, F.1    Brongersma, S.H.2    Mulloy, A.3    Den Toonder, J.M.J.4
  • 18
    • 33749684048 scopus 로고    scopus 로고
    • J.M.Sanchez, S.El-Mansy, B.Sun, T.Scherban, N.Fang, D.Pantuso, W.Ford, M.R.Elizalde, J.M.Martinez-Esnaola, A.Martin-Meizoso, J.Gil-Sevillano, M.Fuentes and J.Maiz.
    • J.M.Sanchez, S.El-Mansy, B.Sun, T.Scherban, N.Fang, D.Pantuso, W.Ford, M.R.Elizalde, J.M.Martinez-Esnaola, A.Martin-Meizoso, J.Gil-Sevillano, M.Fuentes and J.Maiz.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.