Fracture property improvements of a nanoporous thin film via post deposition UV curing

Materials Research Society Symposium Proceedings

Volumn 914, Issue , 2006, Pages 27-32

  Jacques, Jeannette M ^a   Tsui, Ting Y ^a   McKerrow, Andrew J ^a   Kraft, Robert ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; CURING; DIELECTRIC FILMS; DIELECTRIC MATERIALS; FRACTURE; GLASS; MECHANICAL PROPERTIES; PERMITTIVITY; RESIDUAL STRESSES; THIN FILMS; ULTRAVIOLET RADIATION;

ORGANOSILICATE GLASS (OSG); SILICON-BASED MATERIALS; UV CURING;

SILICON;

EID: 33749609736     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-0914-f01-07     Document Type: Conference Paper

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