The effect of elastic modulus on channel crack propagation in organosilicate glass films

Thin Solid Films

Volumn 515, Issue 4, 2006, Pages 2257-2261

  Tsui, Ting Y ^a   Griffin Jr , A J ^a   Fields, Russell ^a   Jacques, Jeannette M ^a   McKerrow, Andrew J ^a   Vlassak, Joost J ^b  

^a TEXAS INSTRUMENTS   (United States)

^b HARVARD UNIVERSITY   (United States)

Author keywords

Cracks; Dielectric films; Elastic properties; Fracture; Low k; Organosilicate

Indexed keywords

CRACKS; DIELECTRIC MATERIALS; ELASTIC MODULI; FRACTURE; FRACTURE MECHANICS; PERMITTIVITY; SILICA; THIN FILMS;

CHANNEL CRACKING; CRACK VELOCITY; ELASTIC PROPERTIES; ORGANOSILICATES;

CRACK PROPAGATION;

EID: 33750843729     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2006.06.022     Document Type: Article

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