-
1
-
-
33749591416
-
-
21-23 Oct. 2003, Montreal, Que
-
Z. Yi, Z. Wen, H. TzuFang, S. Nemani, Y. Kang Sub, H. Amer, X. Li-Qun, and H. M'Saad, Adv. Metal. Conf. 21-23 Oct. 2003, Montreal, Que pp. 543-7 (2004).
-
(2004)
Adv. Metal. Conf.
, pp. 543-547
-
-
Yi, Z.1
Wen, Z.2
Tzufang, H.3
Nemani, S.4
Kang Sub, Y.5
Amer, H.6
Li-Qun, X.7
M'Saad, H.8
-
2
-
-
26444536264
-
-
S. Jain, V. Zubkov, T. Nowak, A. Demos, and J. Rocha, Solid State Technol. 48(9), 43-4 (2005).
-
(2005)
Solid State Technol.
, vol.48
, Issue.9
, pp. 43-44
-
-
Jain, S.1
Zubkov, V.2
Nowak, T.3
Demos, A.4
Rocha, J.5
-
3
-
-
3042719546
-
-
D.A. Maindenberg, W. Volksen, R.D. Miller, and R.H. Dauskart, Nature Materials 3(7), 464-9 (2004).
-
(2004)
Nature Materials
, vol.3
, Issue.7
, pp. 464-469
-
-
Maindenberg, D.A.1
Volksen, W.2
Miller, R.D.3
Dauskart, R.H.4
-
4
-
-
4544318627
-
-
A. Martin Hoyas, J. Schuhmacher, CM. Whelan, J.P. Celis, and K. Maex, Microelectron. Eng. 76(1-4), 32-7 (2004).
-
(2004)
Microelectron. Eng.
, vol.76
, Issue.1-4
, pp. 32-37
-
-
Martin Hoyas, A.1
Schuhmacher, J.2
Whelan, C.M.3
Celis, J.P.4
Maex, K.5
-
5
-
-
3242716168
-
-
C. Jezewski, W.A. Lanford, J.J. Senkevich, C. J. Wiegand, A. Mallikarjunan, D. Lu, G.-C. Wang, T.-M. Lu, and C. Jin, J. Electrochem. Soc. 151(7), F157-161 (2004).
-
(2004)
J. Electrochem. Soc.
, vol.151
, Issue.7
-
-
Jezewski, C.1
Lanford, W.A.2
Senkevich, J.J.3
Wiegand, C.J.4
Mallikarjunan, A.5
Lu, D.6
Wang, G.-C.7
Lu, T.-M.8
Jin, C.9
-
6
-
-
10444246673
-
-
J.J. Senkevic, G.J. Wiegand, G.-R. Yang, and T.-M. Lu, Chem. Vapor. Dep. 10(5) 247-9 (2004).
-
(2004)
Chem. Vapor. Dep.
, vol.10
, Issue.5
, pp. 247-249
-
-
Senkevic, J.J.1
Wiegand, G.J.2
Yang, G.-R.3
Lu, T.-M.4
-
7
-
-
18744367861
-
-
D.-L. Bae, C. Jezewski, T.S. Cale, and J.J. Senkevich, Chem. Vapor. Dep. 11(4), 191-193 (2005).
-
(2005)
Chem. Vapor. Dep.
, vol.11
, Issue.4
, pp. 191-193
-
-
Bae, D.-L.1
Jezewski, C.2
Cale, T.S.3
Senkevich, J.J.4
-
8
-
-
31144463524
-
-
J.S. Juneja, G.A.Ten Eyck, H. Bakhru, and T.-M. Lu, J. Vac. Sci. Technol. B 23(5), 2232-5 (2005).
-
(2005)
J. Vac. Sci. Technol. B
, vol.23
, Issue.5
, pp. 2232-2235
-
-
Juneja, J.S.1
Eyck, G.A.T.2
Bakhru, H.3
Lu, T.-M.4
-
9
-
-
1842529994
-
-
J.J. Senkevich, A. Mallikarjunan, C.J. Wiegand, T.-M. Lu, H.N. Bani-Salameh, and R.L. Lichti, Electrochem. Solid-State Lett. 7(4) G56-58 (2004).
-
(2004)
Electrochem. Solid-state Lett.
, vol.7
, Issue.4
-
-
Senkevich, J.J.1
Mallikarjunan, A.2
Wiegand, C.J.3
Lu, T.-M.4
Bani-Salameh, H.N.5
Lichti, R.L.6
-
10
-
-
28844459479
-
-
Materials, Technology and Reliability of Advanced Interconnects edited by P.R. Besser, A.J. McKerrow, F. Iacopi, C.P. Wong, and J.J. Vlassak. (Pittsburgh, PA)
-
B.P. Carrow, R.E. Murray, B.W. Woods, and J.J. Senkevich in Materials, Technology and Reliability of Advanced Interconnects edited by P.R. Besser, A.J. McKerrow, F. Iacopi, C.P. Wong, and J.J. Vlassak. (Mater. Res. Soc. Sympos. Proc. 863, Pittsburgh, PA, 2005) pp. 189-194.
-
(2005)
Mater. Res. Soc. Sympos. Proc.
, vol.863
, pp. 189-194
-
-
Carrow, B.P.1
Murray, R.E.2
Woods, B.W.3
Senkevich, J.J.4
-
11
-
-
33644947380
-
-
September 27-29, 2005, Colorado Springs, Colorado
-
J.J. Senkevich, B.P. Carrow, B.W. Woods, D.-L. Bae, T.S. Cale, and P.-I Wang Adv. Metal. Conf. (AMC), September 27-29, 2005, Colorado Springs, Colorado, pp. 375-9 (2006).
-
(2006)
Adv. Metal. Conf. (AMC)
, pp. 375-379
-
-
Senkevich, J.J.1
Carrow, B.P.2
Woods, B.W.3
Bae, D.-L.4
Cale, T.S.5
Wang, P.-I.6
-
12
-
-
0042768072
-
-
A. Mallikarjunan, G. Yang, J. J. Senkevich, C. Wiegand, E. Williams, and T.-M. Lu, Electrochem. Solid-State Lett. 6(8), F28-F29 (2003).
-
(2003)
Electrochem. Solid-state Lett.
, vol.6
, Issue.8
-
-
Mallikarjunan, A.1
Yang, G.2
Senkevich, J.J.3
Wiegand, C.4
Williams, E.5
Lu, T.-M.6
-
13
-
-
2342576800
-
-
P.-L Wang, C. J. Wiegand, J.J. Senkevich, and T.-M. Lu, Appl. Phys. Lett. 84(14), 2617-19(2004).
-
(2004)
Appl. Phys. Lett.
, vol.84
, Issue.14
, pp. 2617-2619
-
-
Wang, P.-L.1
Wiegand, C.J.2
Senkevich, J.J.3
Lu, T.-M.4
-
14
-
-
33644918555
-
-
J.S. Juneja, P.-I. Wang, T. Karabacak, and T.-M. Lu, Thin Solid Films 504, 239-242 (2006).
-
(2006)
Thin Solid Films
, vol.504
, pp. 239-242
-
-
Juneja, J.S.1
Wang, P.-I.2
Karabacak, T.3
Lu, T.-M.4
-
15
-
-
0010008803
-
-
low and high dielectric constant materials: materials science processing and reliability issues
-
J. Gaynor, J. Chen, H. Nguyen, G. Brown, K. Taylor, J.D. Luttmer, M. Plano, T. Cleary, J. Wing, and J. Kelly in low and high dielectric constant materials: materials science processing and reliability issues (Proc. Electrochem. Soc. 97-8 1997) pp. 157-67.
-
(1997)
Proc. Electrochem. Soc.
, vol.97
, Issue.8
, pp. 157-167
-
-
Gaynor, J.1
Chen, J.2
Nguyen, H.3
Brown, G.4
Taylor, K.5
Luttmer, J.D.6
Plano, M.7
Cleary, T.8
Wing, J.9
Kelly, J.10
-
17
-
-
84888338425
-
-
October 3-6, Fremont, CA
-
J.J. Senkevich, B.P. Carrow, B.W. Woods, and R.E. Murray, The Twenty Second International VLSI/ULSI Multilevel Interconnection Conference (2005 VMIC), October 3-6, 2005, Fremont, CA, pp. 468-73.
-
(2005)
The Twenty Second International VLSI/ULSI Multilevel Interconnection Conference (2005 VMIC)
, pp. 468-473
-
-
Senkevich, J.J.1
Carrow, B.P.2
Woods, B.W.3
Murray, R.E.4
-
18
-
-
0036648342
-
-
J.J. Senkevich, C.J. Mitchell, A. Vijayaraghavan, E.V. Barnat, J.F. McDonald, and T.-M. Lu, J. Vac. Sci. & Tech. A 20(4), 1445-9 (2002).
-
(2002)
J. Vac. Sci. & Tech. A
, vol.20
, Issue.4
, pp. 1445-1449
-
-
Senkevich, J.J.1
Mitchell, C.J.2
Vijayaraghavan, A.3
Barnat, E.V.4
McDonald, J.F.5
Lu, T.-M.6
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