Porous low-k dielectrics using ultraviolet curing

Solid State Technology

Volumn 48, Issue 9, 2005, Pages 43-46

  Jain, Sanjeev ^a   Zubkov, Vladimir ^a   Nowak, Thomas ^a   Demos, Alex ^a   Rocha, JuanCarlos ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PORE SIZE; POROUS LOW-K DIELECTRICS; THERMAL BUDGET.; ULTRAVIOLET (UV) CURING PROCESS;

COMPOSITION; CURING; KINETIC THEORY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; THERMOANALYSIS; THIN FILMS; ULTRAVIOLET RADIATION;

DIELECTRIC MATERIALS;

EID: 26444536264     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (15)

1. B. Kastenmeier, K. Pfeifer, A. Knorr, Semiconductor Intl., Vol. 27, No. 8, p. 87, 2004.
2. A. Grill, V. Patel, K.P. Rodbell, E. Huang, S. Christiansen, et al., Proc. Mat. Res. Soc. Symp., Vol. 716, p. 569, 2002.
3. J.G. Ryan, Proc. Low-k Dielectric Mat. Tech. Conf. SEMICON West, p. A1, 2000.
4. K. Bochanan, European Semiconductor, Vol. 26, No. 1, p. 19, 2004.
5. K. Macwilliams, J. Huang, M. Schulberg, P. Van Cleemput, Proc. IEEE Intl. Symp. on Semiconductor Manuf., p. 203, 2001.
6. P. Rose, E. Lopata, J. Felts, US Patent No. 6068884, 1998.
7. Handbook of Chemistry and Physics, ed. D.V. Lide, p. 12, 1998-1999.
8. R.J. Le Fevre, "Bond Polarizabilities and Refractions," Adv. Org. Chem., Vol. 3, p. 1, 1965.
9. Handbook of Chemistry and Physics, ed. D.V. Lide, p. 18, 1998-1999.
10. H.J. Kim, Q. Shao, Y.-H. Kim, Surf. Coat. Techn., Vol. 171, p. 39, 2003.
11. B. Xie, A.K. Muscat, Microelectron. Eng., Vol. 76, p. 52, 2004.
12. J.J. Golden, C.J. Hawker, P.S. Ho, Semiconductor Intl., Vol. 24, No. 5, p. 79, 2001.
13. R. Vitris, M.K. O'Neill, J.L. Vincent, A.S. Lukas, B.K. Peterson, et al., Proc. Mat. Res. Soc. Symp., Vol. 766, p. 259, 2003.
14. A. Grill, D.A. Neumayer, J. Appl. Phys., Vol. 94, No. 10, p. 6697, 2003.
15. L. D'Cruz, S. Ahn, Y. Zheng, J. Chang, N. Rajagopalan, et al., MRS Spring Mtg., Mar. 28-April 1, 2005.