Influence of film density on residual stress and resistivity for Cu thin films deposited by bias sputtering

Thin Solid Films

Volumn 358, Issue 1, 2000, Pages 202-205

  Choi, H M ^a   Choi, S K ^a   Anderson, O ^b   Bange, K ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b SCHOTT AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC POTENTIAL; RESIDUAL STRESSES; SPUTTER DEPOSITION; STRESS ANALYSIS; TENSILE STRESS; THIN FILMS; X RAY ANALYSIS;

GRAZING INCIDENCE X RAY REFLECTIVITY ANALYSIS; MORSE POTENTIAL;

METALLIC FILMS;

EID: 0033909304     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(99)00709-9     Document Type: Article

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