Electrodeposition of FeCoNi thin films for magnetic-MEMS devices

Electrochimica Acta

Volumn 51, Issue 28, 2006, Pages 6346-6352

  Yoo, B Y ^a   Hernandez, S C ^a   Park, D Y ^b   Myung, N V ^a  

^a University of California Riverside   (United States)

^b Hanbat National University   (South Korea)

Author keywords

Electrodeposition; FeCoNi; Film stress; Magnetic thin film; Microstructure

Indexed keywords

CORROSION RESISTANCE; ELECTRODEPOSITION; IRON COMPOUNDS; MAGNETIC PROPERTIES; MICROELECTROMECHANICAL DEVICES; MICROSTRUCTURE; NICKEL;

BODY CENTERED CUBIC (BCC); FACE CENTERED CUBIC (FCC); FECONI; FILM STRESS;

MAGNETIC THIN FILMS;

EID: 33748199565     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2006.04.020     Document Type: Article

References (35)

1. Andricacos P.C., and Robertson N. IBM J. Res. Develop. 42 (1998) 671
2. Cooper E.I., Bonhote C., Heidmann J., Hsu Y., Kern P., Lam J.W., Ramasubramanian M., Robertson N., Romankiw L.T., and Xu H. IBM J. Res. Develop. 49 (2005) 103
3. Gomez E., Pellicer E., and Valles E. Electrochem. Commun. 7 (2005) 275
4. Ohashi K., Morita N., Tsuda T., and Nonaka Y. IEEE Trans. Magn. 35 (1999) 2538
5. Osaka T. Electrochim. Acta 44 (1999) 3885
6. Park J.Y., and Allen M. J. Micromech. Microeng. 8 (1998) 307
7. Guan S., and Nelson B.J. J. Electrochem. Soc. 152 (2005) C190
8. Yang H.H., Myung N.V., Yee J., Park D.-Y., Yoo B.-Y., Schwartz M., Nobe K., and Judy J.W. Sens. Actuators A 97-98 (2002) 88
9. Myung N.V., Park D.-Y., Yoo B.-Y., and Sumodjo P.T.A. J. Magn. Magn. Mater. 265 (2003) 189
10. Li X.P., Zhao Z.J., Oh T.B., Seet H.L., Neo B.H., and Koh S.J. Phys. Stat. Sol. 201 (2004) 1992
11. Cavallotti P.L., Bozzini B., Nobili L., and Zangari G. Electrochim. Acta 39 (1994) 1123
12. Cullity B.D. Introduction to Magnetic Materials (1972), Addison-Wesley, Reading, MA p. 529
13. Bradley P.E., Janossy B., and Landolt D. J. Appl. Electrochem. 31 (2001) 137
14. Liu X., Zangari G., and Shamsuzzoha M. J. Electrochem. Soc. 150 (2003) C159
15. Gong J., Butler W.H., and Zangari G. Appl. Phy. Lett. 87 (2005) 012505
16. Osaka T., Takai M., Hayashi K., Ohashi K., Satto M., and Yamada K. Nature 392 (1998) 796
17. Osaka T., Sawaguchi T., Mizutani F., Yokoshima T., Takai M., and Okinaka Y. J. Electrochem. Soc. 146 (1999) 3295
18. Ohashi K., Yasue Y., Saito M., Yamada K., Osaka T., Takai M., and Hayashi K. IEEE Trans. Magn. 34 (1998) 1462
19. Osaka T., Takai M., Hayashi K., Sogawa Y., Ohashi K., Yasue Y., Saito M., and Yamada K. IEEE Trans. Magn. 34 (1998) 1432
20. Osaka T., Takai M., Sogawa Y., Momma T., Ohashi K., Satto M., and Yamada K. J. Electrochem. Soc. 146 (1999) 2092
21. Yokoshima T., Kaseda M., Yamada M., Nakanishi T., Momma T., and Osaka T. IEEE Trans. Magn. 35 (1999) 2499
22. Saito M., Yamada K., Ohashi K., Yasue Y., Sogawa Y., and Osaka T. J. Electrochem. Soc. 146 (1999) 2845
23. Phan N.H., Schwartz M., and Nobe K. J. Appl. Electrochem. 21 (1991) 672
24. Zhang Y., and Podlaha E.J. J. Electrochem. Soc. 147 (2000) 2231
25. Zhang Y., and Podlaha E.J. J. Electrochem. Soc. 150 (2003) C219
26. Zhang Y., and Podlaha E.J. J. Electrochem. Soc. 150 (2003) C225
27. D.-Y. Park, B.Y. Yoo, S. Kelcher, N.V. Myung, Electrochim. Acta.
28. Myung N.V., Park D.-Y., Urgiles E., and George T. Electrochim. Acta. 49 (2004) 4397
29. Kelcher S., Park D.Y., Yoo B.Y., and Myung N.V. Plat. Surf. Fin. 92 (2005) 24
30. Tabakovic I., Inturi V., and Riemer S. J. Electrochem. Soc. 149 (2002) C18
31. Guan S., and Nelson B.J. J. Magn. Magn. Mater. 292 (2005) 49
32. Myung N.V., and Nobe K. J. Electrochem. Soc. 148 (2001) C136
33. Brenner A. Electrodeposition of Alloys (1963), Academic Press, New York p. 84
34. Herzer G. IEEE Trans. Magn. 26 (1990) 1397
35. Safranek W.H. The Properties of Electrodeposited Metal and Alloys: A Handbook (1986), Elsevier, NY p. 262