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Volumn E89-C, Issue 7, 2006, Pages 1052-1056
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Influence of NH3-plasma pretreatment before Si3N 4 passivation film deposition on current collapse in AlGaN/GaN-HEMTs
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Author keywords
AlGaN GaN HEMTs; Current collapse; NH3 plasma pretreatment; Si3N4 passivation film
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Indexed keywords
AUGER ELECTRON SPECTROSCOPY;
CHEMICAL VAPOR DEPOSITION;
GALLIUM NITRIDE;
NITROGEN COMPOUNDS;
SEMICONDUCTING ALUMINUM COMPOUNDS;
SILICON COMPOUNDS;
STOICHIOMETRY;
THRESHOLD VOLTAGE;
ALGAN/GAN-HEMTS;
CURRENT COLLAPSE;
NH3 PLASMA PRETREATMENT;
SI3N4 PASSIVATION FILM;
HIGH ELECTRON MOBILITY TRANSISTORS;
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EID: 33747892406
PISSN: 09168524
EISSN: 17451353
Source Type: Journal
DOI: 10.1093/ietele/e89-c.7.1052 Document Type: Conference Paper |
Times cited : (5)
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References (7)
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