A chemically amplified positive-working photosensitive polyimide based on a blend of poly(amic acid ethoxymethyl ester) and poly(amic acid)

Polymer

Volumn 47, Issue 19, 2006, Pages 6652-6658

  Jung, Myung Sup ^a,b   Joo, Won Jae ^a   Choi, Byoung Ki ^a   Jung, Hee Tae ^b  

^a Samsung Advanced Institute of Technology (SAIT)   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Lithography; Photosensitive; Polyimide

Indexed keywords

CARBOXYLIC ACIDS; ELECTRONICS PACKAGING; FILMS; MOLECULAR WEIGHT; PHOTOLITHOGRAPHY; PHOTOSENSITIVITY; THERMODYNAMIC PROPERTIES;

HYDROXIDE SOLUTION; IMIDIZATION; PHOTOACID GENERATOR (PAG); SEMICONDUCTOR PACKAGING;

ESTERIFICATION;

MECHANICAL PROPERTY; MOLECULAR WEIGHT; POLYIMIDE; POLYMER BLEND; THERMAL PROPERTY;

EID: 33747759714     PISSN: 00323861     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymer.2006.06.039     Document Type: Article

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