Fluxless flip-chip solder joint fabrication using electroplated Sn-rich Sn-Au structures

IEEE Transactions on Advanced Packaging

Volumn 29, Issue 3, 2006, Pages 473-482

  Kim, Jongsung ^a   Kim, Dongwook ^b   Lee, Chin C ^a  

^a University of California at Irvine   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

Au; AuSn4 intermetallics; Cr; Electroplating; Fluxless flip chip bonding; Sn

Indexed keywords

ENERGY DISPERSIVE SPECTROSCOPY; EUTECTICS; GROWTH (MATERIALS); INTERMETALLICS; NUCLEATION; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; TIN ALLOYS; X RAY DIFFRACTION ANALYSIS;

ELECTROPLATED MULTILAYER SOLDER BUMPS; FLUXLESS FLIP-CHIP BONDING; FLUXLESS FLIP-CHIP SOLDER JOINT; GROWTH MECHANISM; INTERMETALLIC NUCLEATION;

ELECTROPLATING;

EID: 33747721515     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2006.875414     Document Type: Article

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