Fluxless bonding process in air using Sn-Bi-Au design

Materials Science and Engineering: A

Volumn 372, Issue 1-2, 2004, Pages 261-268

  Kim, Dongwook ^a   Lee, Chin C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

AuSn2 and AuSn4; Fluxless bonding; Gold; Intermetallic compound; Tin

Indexed keywords

CRYSTALLINE MATERIALS; DUCTILE FRACTURE; GROWTH (MATERIALS); INTERMETALLICS; MELTING; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; X RAY DIFFRACTION; X RAY PHOTOELECTRON SPECTROSCOPY;

FLUXLESS BONDING TECHNIQUE; PHASE GROWTH MECHANISM; PICK-AND-PLACE MACHINES; TOP-CAPPING LAYER;

BONDING;

DESIGN;

EID: 2142763058     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2004.01.009     Document Type: Article

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