Structure decomposition for hybrid analysis of multilayer interconnect systems

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn 2002-January, Issue , 2002, Pages 137-140

  Orhanovic, Neven ^a   Divekar, Dileep ^a   Matsui, Norio ^a  

^a Applied Simulation Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING;

HYBRID ANALYSIS; INTERCONNECT SYSTEMS; POWER DISTRIBUTIONS; SEPARATE ANALYSIS; SIGNAL PROPAGATION; STRUCTURE DECOMPOSITION;

DECOMPOSITION;

EID: 84946028271     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2002.1057900     Document Type: Conference Paper

References (8)

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