Modeling of non-ideal planes in stripline structures

Electrical Performance of Electronic Packaging

Volumn , Issue , 2003, Pages 247-250

  Engin, A Ege ^a   John, Werner ^b   Sommer, Grit ^a   Mathis, Wolfgang ^b  

^a Department of Mechanical Reliability in Microtechnology   (Germany)

^b LEIBNIZ UNIVERSITY HANNOVER   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; MICROSTRIP LINES;

MULTI-CONDUCTOR TRANSMISSION LINE MODEL; NON IDEALS; POWER PLANES; SIGNAL LINES; STRIPLINE STRUCTURES;

STRIP TELECOMMUNICATION LINES;

EID: 33747620340     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2003.1250042     Document Type: Conference Paper

References (3)

1. L. Smith. "Simultaneous Switch Noise and Power Plane Bounce for CMOS Technology". IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging, pages 163-165, Oct. 1999.
2. C.R. Paul. Analysis of Multiconductor Transmission lines. John Wiley and Sons, 1994.
3. S. Chun, L. Smith, R. Anderison and M. Swaminathan. "Model to Hardware Correlation for Power Distribution Induced I/O Noise in a Functioning Computer System". Electronic Components and Technology Conference (ECTC), pages 319-324, May 2002.