Characterizing stress in ultrathin silicon wafers

Applied Physics Letters

Volumn 89, Issue 7, 2006, Pages

  Paul, Indrajit ^a   Majeed, Bivragh ^a   Razeeb, Kafil M ^a   Barton, John ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

DIODES; LASER APPLICATIONS; LEAKAGE CURRENTS; RESIDUAL STRESSES; SEMICONDUCTOR JUNCTIONS; STRESS ANALYSIS; ULTRATHIN FILMS;

BAND GAP; CURRENT GRINDING PROCESS; MECHANICAL GRINDING; P-N JUNCTION;

SILICON WAFERS;

EID: 33747487796     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2336212     Document Type: Article

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