An investigation of the contact resistance of a commercial elastomer interconnect under thermal and mechanical stresses

IEEE Transactions on Device and Materials Reliability

Volumn 3, Issue 2, 2003, Pages 39-43

  Liu, Weifeng ^a   Lee, Mikyoung ^b   Pecht, Michael ^b   Martens, Rod ^c  

^a HEWLETT PACKARD COMPANY   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

^c FORMFACTOR INC   (United States)

Author keywords

Contact resistance; Elastomer interconnect; Reliability; Socket

Indexed keywords

ELASTOMERS; INTERFACES (MATERIALS); SILICONES; STRESSES; THERMAL EXPANSION; THERMAL LOAD;

CONTACT RESISTANCE; ELASTOMER INTERCONNECTS; LONG TERM RELIABILITY;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 3042844000     PISSN: 15304388     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDMR.2003.814262     Document Type: Article

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