Humidity management of outdoor electronic equipment: Methods, pitfalls, and recommendations

IEEE Transactions on Components and Packaging Technologies

Volumn 25, Issue 1, 2002, Pages 66-72

  Tencer, Michal ^a   Moss, John Seaborn ^b  

^a NORTEL NETWORKS   (Canada)

^b Dependable Technology Planning   (Canada)

Author keywords

Absolute humidity management; Coatings; Conductive filament; Dewpoint management; Diffusion; Failure; Gel; Grease; Humidity; Metal migration; Moisture; Outdoor equipment; Outside plant; Potting; Printed circuit; Relative humidity management; Reliability; Saturation limit management; Surface resistance; Water; Weatherproofing

Indexed keywords

ATMOSPHERIC HUMIDITY; COATING TECHNIQUES; COOLING; DIFFUSION; HEAT LOSSES; PRINTED CIRCUIT BOARDS; RELIABILITY; TEMPERATURE CONTROL;

ABSOLUTE HUMIDITY MANAGEMENT; SATURATION LIMIT MANAGEMENT;

ELECTRONIC EQUIPMENT;

EID: 0036505677     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.991177     Document Type: Article

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