Correlation between material composition, processing, chemical bonding state, and electrochemical migration failure rate in isolating compounds of high density microelectronics systems

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 765-771

  Harsanyi, Gabor ^a   Illyefalvi Vitez, Zsolt ^a   Jones, W Kinzy ^a  

^a BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

[No Author keywords available]

Indexed keywords

CATHODES; CHEMICAL BONDS; COMPOSITION; ELECTRIC CONDUCTORS; ELECTRIC INSULATORS; ELECTRODEPOSITION; ELECTROMIGRATION; FAILURE ANALYSIS; IONS; METALS; RELIABILITY; SHORT CIRCUIT CURRENTS;

CHEMICAL BONDING STATE; CHEMICAL REDUCTION PROCESS; DENDRITIC SHORT CIRCUIT GROWTH; ELECTROCHEMICAL MIGRATION FAILURE RATE; HIGH DENSITY MICROELECTRONIC SYSTEMS;

MICROELECTRONIC PROCESSING;

EID: 0029697092     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (14)