Fundamental reliability issues associated with a commercial particle-in-elastomer interconnection system

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 3, 2001, Pages 520-525

  Liu, Weifeng ^b   Pecht, Michael G ^a,b   Xie, Jingsong ^a,c  

^a IEEE

^b UNIVERSITY OF MARYLAND   (United States)

^c MICROSOFT   (United States)

Author keywords

Contact resistance; Durability; Elastomer interconnect; Elastomer socket; Stress relaxation

Indexed keywords

DURABILITY; ELASTOMERS; RELIABILITY; STRESS RELAXATION; SURFACE MOUNT TECHNOLOGY;

CONTACT RESISTANCE; ELASTOMER INTERCONNECT; ELASTOMER SOCKET;

ELECTRONICS PACKAGING;

EID: 0035441283     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.946501     Document Type: Article

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