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Physica Status Solidi (C) Current Topics in Solid State Physics

Volumn 3, Issue , 2006, Pages 2133-2136

High quality tin zinc oxide/Ag ohmic contacts for UV flip-chip light-emitting diodes

(8) Hong, Hyun Gi a Ban, K Y a Song, June O b Cho, J c Park, Y c Kwak, J S d Ferguson, Ian T b Seong, Tae Yeon e

a Gwangju Institute of Science and Technology (GIST) (South Korea)

b GEORGIA INSTITUTE OF TECHNOLOGY (United States)

c Samsung Advanced Institute of Technology (SAIT) (South Korea)

d Sunchon National University (South Korea)

e Korea University (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT RESISTIVITY; NEAR-UV LED; OHMIC FORMATION; REVERSE VOLTAGE; 73.40.CG; 82.80.PV; 85.60.JB; CONTACT RESISTIVITIES; FLIP-CHIP LIGHT-EMITTING DIODES; REVERSE LEAKAGE CURRENT; REVERSE VOLTAGES;

FLIP CHIP DEVICES; LEAKAGE CURRENTS; LIGHT EMITTING DIODES; TIN COMPOUNDS; ULTRAVIOLET DEVICES; X RAY PHOTOELECTRON SPECTROSCOPY; ELECTRIC CONTACTORS; OHMIC CONTACTS; PHOTOELECTRONS; SILVER;

OHMIC CONTACTS; LIGHT EMITTING DIODES;

EID: 33746356523 PISSN: 18626351 EISSN: None Source Type: Journal
DOI: 10.1002/pssc.200565175 Document Type: Conference Paper

Times cited : (1)

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