Lead-free solder bumping by the electroplating process for electronic packaging

IEEE Region 10 Annual International Conference, Proceedings/TENCON

Volumn 4, Issue , 2003, Pages 1367-1371

  Joseph, Shany ^a   Phatak, G J ^a   Seth, Tanay ^a   Gurunathan, K ^a   Amalnerkar, D P ^a   Kutty, T R N ^b  

^a CENTRE FOR MATERIALS FOR ELECTRONICS TECHNOLOGY C MET   (India)

^b INDIAN INSTITUTE OF SCIENCE   (India)

Author keywords

[No Author keywords available]

Indexed keywords

CHELATION; COMPOSITION; CURRENT DENSITY; DEPOSITION; DIFFUSION; FATIGUE OF MATERIALS; NOISE ABATEMENT; OPTIMIZATION; PH EFFECTS; PROBLEM SOLVING; SIGNAL PROCESSING; SOLDERING ALLOYS;

COMPACT FILMS; ELECTRONIC PACKAGING; MATCHING PADS; SOLDER BUMPING;

ELECTROPLATING;

EID: 2342515944     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. Rao R. Tummala, Eugene J. Rymaszewski and Alan G. Klopfenstein, Microelectronics Packaging Handbook, Vol. - II, Kluwer Academic Publishers, 1999.
2. Jack Bogdanski, The Eonomics of Bump and Flip, www.flipchips.com, Referred on June 03, 2003.
3. J H Lau and S. W. Ricky Lee, "Failure Analysis of Solder Bumped Flip chip on low cost substrates", IEEE Trans. Electron. Packag. Manufact. 23, 19, 2000.
4. J H Lau, Flip Chip Technologies, McGraw Hill, New York, 1996.
5. Brain Injury Law Group, Lead Poisoning in Children, www.leadinfo.com; Referred on June 18, 2003.
6. K. Gurunathan, S. Joseph, D. R. Yewale, A. N. Phalke, T. Seth, G. J. Phatak, D. P. Amalnerkar and T. R. N. Kutty, "Electroplating of Tin and its Alloys for Electronic Packaging", Trans. SAEST, 37, 127, 2002.
7. John H Lau, S.W. Ricky Lee, Microvias for low cost high density interconnects, McGraw Hill, 2001.
8. Dr. Jennie S. Hwang, "Bismuth in Electronic Solder (Part I), The Bulletin of Bismuth Institute, 78, 2001.
9. Rao R. Tummala, Eugene, J. Ryma, S Zewski, Alan G Klopfenstein, Microelectronic Packaging Handbook, Part III, Chapman and Hall, 1993.
10. Mordechay Schlesinger, and Milan Paunovic, Modern electroplating, Wiley Interscience, 2000.
11. N. V. Partha Sarathy, Practical Electroplating Handbook, Prentice Hall, 1981.