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Volumn 130-131, Issue SPEC. ISS., 2006, Pages 583-587

Meso-scale adhesion testing of integrated micro- and nano-scale structures

Author keywords

3D; Adhesion; Dry adhesive; Gecko; MEMS; Nanoindenter; Nanorod

Indexed keywords

MATERIALS TESTING; MESOPOROUS MATERIALS; NANOTECHNOLOGY; SILICA; SURFACE PHENOMENA; VAN DER WAALS FORCES;

EID: 33745852745     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2005.10.032     Document Type: Article
Times cited : (62)

References (19)
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    • A batch fabricated biomimetic dry adhesive
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  • 10
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    • Capacitive humidity sensors in SACMOS technology with moisture absorbing photosensitive polyimide
    • Karlsruhe, West Germany
    • Boltshauser T., and Baltes H. Capacitive humidity sensors in SACMOS technology with moisture absorbing photosensitive polyimide. Proceedings of the Eurosensors IV '90. Karlsruhe, West Germany (1991) 509-512
    • (1991) Proceedings of the Eurosensors IV '90 , pp. 509-512
    • Boltshauser, T.1    Baltes, H.2
  • 13
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    • Nanometer-scale force sensing with MEMS devices
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    • Kenny, T.1
  • 16
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    • Effect of cubic nonlinearity on auto-parametrically amplified resonant MEMS mass sensor
    • Zhang W., Baskaran R., and Turner K.L. Effect of cubic nonlinearity on auto-parametrically amplified resonant MEMS mass sensor. Sens. Actuators A (Phys.) 102 1-2 (2002) 139-150
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    • Zhang, W.1    Baskaran, R.2    Turner, K.L.3
  • 18
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    • High aspect ratio polymer micro/nano-structure manufacturing using nanoembossing, nanomolding and directed self-assembly
    • IEEE, Piscataway, NJ, USA
    • Sitti M. High aspect ratio polymer micro/nano-structure manufacturing using nanoembossing, nanomolding and directed self-assembly. Proceedings of the 2003 IEEE/ASME International Conference on Advanced Intelligent Mechatronics AIM 2003 (2003), IEEE, Piscataway, NJ, USA 886-890
    • (2003) Proceedings of the 2003 IEEE/ASME International Conference on Advanced Intelligent Mechatronics AIM 2003 , pp. 886-890
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.