Stabilization of gamma alumina slurry for chemical-mechanical polishing of copper

Journal of Colloid and Interface Science

Volumn 300, Issue 2, 2006, Pages 603-611

  Song, Myung Geun ^a   Lee, Jin ho ^a   Lee, Yoon Gyu ^a   Koo, Ja ho ^a  

^a Samsung Corning Co Ltd   (South Korea)

Author keywords

Alumina; Chemical mechanical polishing; CMP; Copper; Dispersion stability; Mixed dispersant; Wet grinding

Indexed keywords

ADSORPTION; ALUMINA; COPPER; HYDRATION; VISCOSITY;

Γ-ALUMINA; DISPERSION STABILITY; MIXED DISPERSANT; WET GRINDING;

CHEMICAL MECHANICAL POLISHING;

ALUMINUM OXIDE; COPPER;

ADSORPTION; ARTICLE; ELECTRICITY; EVALUATION; HYDRATION; PARTICLE SIZE; PRIORITY JOURNAL; STEREOCHEMISTRY; SUSPENSION; VISCOSITY; X RAY DIFFRACTION;

EID: 33745845490     PISSN: 00219797     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jcis.2006.04.046     Document Type: Article

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