A suspending abrasives and porous pad model for the analysis of lubrication in chemical mechanical polishing

Key Engineering Materials

Volumn 315-316, Issue , 2006, Pages 775-778

  Liu, J Y ^a   Quo, D M ^a   Jin, Z J ^a   Kang, R K ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

CMP; Porous pad; Suspending abrasive

Indexed keywords

ABRASIVES; CHEMICAL MECHANICAL POLISHING; FLUID MECHANICS; NANOSTRUCTURED MATERIALS; POROSITY; POROUS MATERIALS; SLURRIES;

MICROPOLAR FLUID THEORY; POROUS PADS; SUSPENDING ABRASIVES; THREE-DIMENSIONAL LUBRICATION MODEL;

LUBRICATION;

EID: 33745623404     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/0-87849-999-7.775     Document Type: Conference Paper

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