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Volumn 304-305, Issue , 2006, Pages 359-363
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Effects of suspending abrasives on the lubrication properties of slurry in chemical mechanical polishing of silicon wafer
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Author keywords
CMP; Micro polar fluid; Silicon wafer; Suspending abrasive
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Indexed keywords
ABRASIVES;
LUBRICATION;
SILICON WAFERS;
SLURRIES;
FLUID PRESSURE ACTING;
MICRO-POLAR FLUID;
SUSPENDING ABRASIVE;
CHEMICAL MECHANICAL POLISHING;
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EID: 33644854869
PISSN: 10139826
EISSN: 16629795
Source Type: Book Series
DOI: 10.4028/0-87849-986-5.359 Document Type: Conference Paper |
Times cited : (2)
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References (9)
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