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Volumn 304-305, Issue , 2006, Pages 359-363

Effects of suspending abrasives on the lubrication properties of slurry in chemical mechanical polishing of silicon wafer

Author keywords

CMP; Micro polar fluid; Silicon wafer; Suspending abrasive

Indexed keywords

ABRASIVES; LUBRICATION; SILICON WAFERS; SLURRIES;

EID: 33644854869     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/0-87849-986-5.359     Document Type: Conference Paper
Times cited : (2)

References (9)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.