Surface tension measurements of the Bi-Sn and Sn-Bi-Ag liquid alloys

Journal of Electronic Materials

Volumn 30, Issue 9, 2001, Pages 1104-1111

  Moser, Z ^a   Gasior, W ^a   Pstrus, J ^a  

^a INSTITUTE OF METALLURGY AND MATERIALS SCIENCE   (Poland)

Author keywords

Butler's method; Density of Bi Sn and Ag Bi Sn; Pb free solders; Surface tension

Indexed keywords

BISMUTH ALLOYS; DENSITY (SPECIFIC GRAVITY); EQUATIONS OF STATE; EUTECTICS; MATHEMATICAL MODELS; PRESSURE EFFECTS; SILVER ALLOYS; SURFACE MEASUREMENT; SURFACE TENSION; THERMAL EFFECTS;

BUTLER METHOD; LIQUID ALLOYS; MOLAR FRACTIONS; SURFACE TENSION MEASUREMENTS;

SOLDERING ALLOYS;

EID: 0035455436     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-001-0136-6     Document Type: Article

References (33)

1. Experimental surface tension measurements of Pb-free solders vs. modelling