The influence of wall slip in the measurement of solder paste viscosity

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 3, 2001, Pages 468-473

  Ekere, N N ^a,b   He, D ^b   Cai, L ^b  

^a IEEE   (United Kingdom)

^b UNIVERSITY OF SALFORD   (United Kingdom)

Author keywords

Concentrated suspensions; Rheology; SMT; Solder pastes; Viscosity; Wall slip

Indexed keywords

SHEAR RATE; SOLDER PASTE; WALL SLIP;

ADHESIVE PASTES; BOUNDARY LAYERS; MATHEMATICAL MODELS; PRINTED CIRCUIT MANUFACTURE; RHEOLOGY; SHEAR STRESS; VISCOSITY MEASUREMENT;

ELECTRONICS PACKAGING;

EID: 0035441295     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.946495     Document Type: Article

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