Development of high speed printing solder pastes for fine pitch applications

Soldering and Surface Mount Technology

Volumn , Issue 26, 1997, Pages 29-32

  Warwick, M ^a   Harpley, I ^a  

^a Multicore Solders Ltd   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FLOW OF FLUIDS; PERFORMANCE; PHYSICAL PROPERTIES; POLYMERS; PRINTING; RHEOLOGY; SOLUTIONS; SOLVENTS; SURFACE MOUNT TECHNOLOGY;

FINE PITCH PRINTING; HIGH SPEED PRINTING; SOLDER PASTE;

ADHESIVES;

EID: 0031189774     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)