Viscoelastic properties of solder pastes

Journal of Electronic Materials

Volumn 27, Issue 3, 1998, Pages 138-148

  Lapasin, Romano ^a   Pricl, Sabrina ^a   Sirtori, Vittorio ^b   Casati, Donato ^b  

^a UNIVERSITY OF TRIESTE   (Italy)

^b IBM   (Italy)

Author keywords

Plasticity; Rheology; Screening process; Solder paste; Viscoelasticity

Indexed keywords

PHASE TRANSITIONS; RHEOLOGY; SHEAR STRESS; STRAIN; SURFACE MOUNT TECHNOLOGY; VISCOELASTICITY;

SOLDER PASTES;

ADHESIVES;

EID: 0032024343     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-998-0204-2     Document Type: Article

References (13)

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