The growth behavior of intermetallic compound layer of Sn-Ag-Cu/Cu interface during soldering

Proceeding of 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC

Volumn 2005, Issue , 2005, Pages 86-90

  Yu, D Q ^a   Wang, J H ^a   Wang, L ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Growth; Intermetallic compounds; Lead free solder; Melting point; Sn Ag Cu

Indexed keywords

LEAD FREE SOLDER; MELTING POINT; SN-AG-CU;

DISSOLUTION; METAL MELTING; PRECIPITATION (CHEMICAL); REACTION KINETICS; SOLDERING; SOLDERING ALLOYS; SUBSTRATES;

INTERMETALLICS;

EID: 33744989002     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/AGEC.2005.1452322     Document Type: Conference Paper

References (18)

1. K. N. Tu, K. Zeng, Mater. Sci. Eng. R 34, 1-58 (2001).
2. D. R. Frear, JOM 48(5), 49-53 (1996).
3. J. K. Shang and D. Yao, J. Electron. Packag. 118(3), 170-173 (1996).
4. D. Yao and J. K. Shang, IEEE Trans. CPMT - Part B, 18(8): 605 (1996)
5. W. J. Boetting, C. A. Handwerker, and L. C. Smith, The metal science of jointing, edited by M. J. Cieslak, J. H. Pererpezko, S. Kang, and M. J. Glicksman (The Minerals, Metals and Materails Society, Warrendale, Pennsylvania, 1992), p 183
6. Y. Y. Chen, J. G. Duh, J Mater. Sci., Mater. Electron., 11:279 (2000)
7. A. S. Zuruzi, C. h, Chiu, S. K. Lahiri, K. N. Tu, J appl. Phys., 86 (9): 4916 (1999)
8. C. M. L. Wu, D. Q. Yu, C. M. T. Law, and L. Wang, Mater. Sci. Eng. R 44, 2004, 1-44
9. C. M. L. Wu, D. Q. Yu, C. M. T. Law and L. Wang, Alloys, J Electron Mater., 2002, 31 (9): 928-932
10. Abtew M, Selvaduray G., Mater. Sci, Eng. R 27 (1), 85 (2000)
11. Miller CM, Anderson IE, Smith JF, J Electron Mater, 23 (7), 595 (1994)
12. Loomans ME, Fine ME, Metal Mater Trans A, 31A, 1155(2000)
13. Moon KW, Boettinger WJ, Kattner UR, Biancaniello FS, Handwerker CA, J Electron Mater., 29, 1122 (2000)
14. C. E. Ho, R. Y. Tsai, Y. L. Lin, and C. R. Kao, J Electron Mater, 31: 584-599, 2002
15. V. I. Dybkov, Growth Kinetics of Chemical Compound Layer (Cambridge International Science, Cambridge, 1998)
16. M. Schaefer, R. A. Fournelle, J. Liang, J Electron Mater, 27(11), 1167 (1998)
17. S. Chada, R. A. Fouruelle, W. Laub, D. Shangguan, J Electron Mater., 29 (10), 1214 (2000)
18. Jong-Hyun Lee, Dea-Jin Park, Jung-Na Heo, Yong-Ho Lee, Dong-Hyuk Shin and Yong-Seog Kim. Reflow, Scripta mater., 42, 827 (2000)