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Volumn 2005, Issue , 2005, Pages 178-184

Wetting and interfacial reactions of Sn-Zn based lead-free solder alloys as replacement of Sn-Pb solder

Author keywords

Dissolution of Cu; Intermetallics; Sn Zn based solders

Indexed keywords

EUTECTICS; INTERFACES (MATERIALS); INTERMETALLICS; TIN ALLOYS; TOXICITY; WETTING;

EID: 33744967069     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/AGEC.2005.1452341     Document Type: Conference Paper
Times cited : (4)

References (20)
  • 3
    • 15544384203 scopus 로고    scopus 로고
    • City University of Hong Kong, Organized by the EPA Centre, City University of Hong Kong, December 30
    • W. Jillek, Training Course on Manufacturing Green Electronics, City University of Hong Kong, Organized by the EPA Centre, City University of Hong Kong, December 30, 2003.
    • (2003) Training Course on Manufacturing Green Electronics
    • Jillek, W.1
  • 19


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.