-
1
-
-
0033343078
-
Power distribution system design methodology and capacitor selection for modern CMOS technology
-
August
-
L.D. Smith, R.E. Anderson, D.W. Forehand, T.J. Pelc, T. Roy, "Power distribution system design methodology and capacitor selection for modern CMOS technology", IEEE Transactions on Advanced Packaging, vol. 22, no. 3, August 1999.
-
(1999)
IEEE Transactions on Advanced Packaging
, vol.22
, Issue.3
-
-
Smith, L.D.1
Anderson, R.E.2
Forehand, D.W.3
Pelc, T.J.4
Roy, T.5
-
2
-
-
0037297131
-
Power-bus decoupling with embedded capacitance in printed circuit board design
-
February
-
M. Xu, T.H. Hubing, J. Chen, T.P. Van Doren, J.L. Drewnial, and R.E. DuBroff, "Power-bus decoupling with embedded capacitance in printed circuit board design", IEEE Transactions on Electromagentic Compatibility, vol. 45, no. 1, pp 22-30, February 2003.
-
(2003)
IEEE Transactions on Electromagentic Compatibility
, vol.45
, Issue.1
, pp. 22-30
-
-
Xu, M.1
Hubing, T.H.2
Chen, J.3
Van Doren, T.P.4
Drewnial, J.L.5
Dubroff, R.E.6
-
3
-
-
1642402127
-
Suppression of GHz range power/ground inductive impedance and simultaneous switching noise using embedded film capacitors in multilayer packages and PCBs
-
February
-
Hyungsoo Kim, Byung Kook Sun, and Joungho Kim, "Suppression of GHz Range Power/Ground Inductive Impedance and Simultaneous Switching Noise Using Embedded Film Capacitors in Multilayer Packages and PCBs", IEEE Microwave and Wireless Components Letters, vol. 14, no. 2, pp 71-74, February 2004.
-
(2004)
IEEE Microwave and Wireless Components Letters
, vol.14
, Issue.2
, pp. 71-74
-
-
Kim, H.1
Sun, B.K.2
Kim, J.3
-
4
-
-
0037250704
-
A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface
-
January
-
T. Kamgaing, and O.M. Ramahi, "A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface", in IEEE Microwave and Wireless Components Letters, Vol. 13, No. 1, pp 21-23, January, 2003.
-
(2003)
IEEE Microwave and Wireless Components Letters
, vol.13
, Issue.1
, pp. 21-23
-
-
Kamgaing, T.1
Ramahi, O.M.2
-
5
-
-
0038614784
-
Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits
-
June
-
R. Abhari, and G.V. Eleftheriades, "Metallo-Dielectric Electromagnetic Bandgap Structures for Suppression and Isolation of the Parallel-Plate Noise in High-Speed Circuits", IEEE Transactions on Microwave Theory and Techniques, vol. 51, no. 6, pp 1629-1639, June 2003.
-
(2003)
IEEE Transactions on Microwave Theory and Techniques
, vol.51
, Issue.6
, pp. 1629-1639
-
-
Abhari, R.1
Eleftheriades, G.V.2
-
7
-
-
0034239323
-
Modeling and transient simulation of planes in electronic packages
-
August
-
N. Na, J. Choi, S. Chun, M. Swaminathan, and J. Srinivasan, "Modeling and Transient Simulation of Planes in Electronic Packages", IEEE Transaction on Advanced Packaging, vol. 23, no. 3, pp 340-352, August 2000.
-
(2000)
IEEE Transaction on Advanced Packaging
, vol.23
, Issue.3
, pp. 340-352
-
-
Na, N.1
Choi, J.2
Chun, S.3
Swaminathan, M.4
Srinivasan, J.5
-
8
-
-
4644258794
-
Efficiency of differential signaling on cavity noise suppression in applications with reference plane change
-
9-13 Aug.
-
Junho Lee, Jaemin Kim, Joungho Kim, Lu, A.C.W, Wei Fan, Wai, L.L., "Efficiency of differential signaling on cavity noise suppression in applications with reference plane change", 2004 International Symposium on Electromagnetic Compatibility, Vol. 1, Pages:203-208, 9-13 Aug. 2004
-
(2004)
2004 International Symposium on Electromagnetic Compatibility
, vol.1
, pp. 203-208
-
-
Lee, J.1
Kim, J.2
Kim, J.3
Lu, A.C.W.4
Fan, W.5
Wai, L.L.6
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