A back-to-face silicon layer stacking for three-dimensional integration

Proceedings - IEEE International SOI Conference

Volumn 2005, Issue , 2005, Pages 87-89

  Tan, C S ^a   Chen, K N ^a   Fan, A ^a   Reif, R ^a  

^a Massachusetts Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 33744762736     PISSN: 1078621X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SOI.2005.1563545     Document Type: Conference Paper

References (13)

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