Microchannel heat sink fabrication with roughened bottom walls

Microsystem Technologies

Volumn 12, Issue 8, 2006, Pages 760-765

  Yang, H ^a   Lee, F ^a   Chein, R ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; CRYSTAL ORIENTATION; ETCHING; HEAT TRANSFER; SURFACE ROUGHNESS;

PARALLELOGRAMS; ROUGHENED MICROSTRUCTURES; VERTICAL SIDEWALLS; WET ANISOTROPIC ETCHING;

HEAT SINKS;

EID: 33744529776     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-006-0145-8     Document Type: Article

References (19)

1. Baralas CA (1990) Review of argumentation techniques for heat transfer surface in single-phase heat exchangers. Energy 15:899906
2. Bar-Cohen A (1996) Thermal management of electronic components with dielectric liquids. In: Lloyd JR, Kurosaki Y (eds) Proceedings of ASME/JSME Thermal Engineering Joint Conference 2:15-39
3. Barycka I, Zubel I (1995) Silicon anisotropic etching in KOH-isopropanol etchant. Sens Actuators A 48:229-238
4. Bergles AE (2002) ExHFT for fourth generation heat transfer technology. Exp Therm Fluid Sei 26:335-344
5. Dong W et al (2004) Mechanism for convex corner undercutting of (110) silicon in KOH. Microelectron J 35:417-419
6. Dwivedi VK et al (2000) Fabrication of very smooth walls and bottoms of silicon microchannels for heat dissipation of semiconductor devices. Microelectron J 31:405-410
7. Hetsroni G et al (2002) A uniform temperature heat sink for cooling of electronic devices. Int J Heat Mass Transf 45:3275-3286
8. Kendall L (1975) On etching very narrow grooves in silicon. Appl Phys Lett 26:195-198
9. Kleiner MB et al (1995) High performance forced air cooling scheme employing microchannel heat exchangers. IEEE Trans Compon Packag Manuf Technol 18:795-804
10. Knight RW et al (1991) Optimal thermal design of forced convection heat sinks-analytical. J Electron Packag 113:313-321
11. Madou MJ (1997) Fundamentals of micro-fabrication. CRC Press, Boca Raton
12. Morini GL (2004) Single-phase convective heat transfer in microchannels: a review of experimental results. Int J Therm Sci 43:631-651
13. Mudawar I (2001) Assessment of high-heat-flux thermal management schemes. IEEE Trans Compon Packag Manuf Technol 24:122-141
14. Perret C et al (2000) Analytic modeling, optimization, and realization of cooling devices in silicon technology. IEEE Trans Compon Packag Technol 23:665-672
15. Sato K et al (1998) Characterization of orientation-dependent etching properties of single-crystal silicon: effects of KOH concentration. Sens Acuators A 64:87-93
16. The International Technology Roadmap for Semiconductors, Semiconductor Industry Association, 2002 edition
17. Tseng FG, Chang KC (2002) Precise [100] crystal orientation determination on (110)-oriented silicon wafers. J Micromech Microeng 13:47-52
18. Webb RL (1993) Principles of enhanced heat transfer. Wiley, New York
19. Zhang QX et al (1996) A new approach to convex corner compensation for anisotropic etching of (100) Si in KOH. Sens Actuators A 56:251-254